三、代表性科研成果: 论文: (1)L. Chen, M. Ma, J. Cao, J. Sun, M. Que, and Y. Sun. “Impact of oxygen in electrical properties and hot-carrier stress-induced degradation of GaN high electron mobility transistors”, Chinese Physics B, 2021, 30(10): 108502 (2)L. Chen, H. Wang, B. Hou, M. Liu, L. Shen, X. Lu, X. Ma, and Y. Hao. “Hetero-integration of Quasi Two Dimensional PbZr0.2Ti0.8O3 and GaN/AlGaN HEMT and Non-volatile Modulation of 2DEG.” Applied Physics Letters, 2019, 115(19):193505. (3)L. Chen, X. Ma, J. Zhu, B. Hou, F. Song, Q. Zhu, M. Zhang, L. Yang, and Y. Hao. “Polarization Engineering in PZT/AlGaN/GaN High-Electron-Mobility Transistors.” IEEE Transactions on Electron Devices, 2018, 65(8): 3149-3155. (4)L. Chen, X. Ma, J. Zhu, B. Hou, Q. Zhu, M. Zhang, L. Yang, J. Yin, J. Wu, and Y. Hao. “Direct Observation of Gate Leakage Paths in AlGaN/GaN High Electron Mobility Transistors by Electron Beam-Induced Current.” IEEE Transactions on Device and Materials Reliability, 2018, 18(3): 259-363. (5)L. Chen, Q. Zhu, B. Hou, J. Zhu, X. Ma, and Y. Hao. “Influence of the oxygen in Hot-Carrier-Stress-Induced degradation in AlGaN/GaN high electron mobility transistors.” The 1st Workshop on Wide Bandgap Power Devices and Applications in Asia, 2018. (6)L. Chen, X. Ma, J. Zhu, B. Hou, M. Zhang, L. Yang, and Y. Hao. “Direct observation of gate leakage paths in AlGaN/GaN HEMTs by EBIC.” The 12th International Conference on Nitride Semiconductors (ICNS), 2017. (7) J. Zhu,L. Chen, J. Jiang, X. Lu, L. Yang, B. Hou, M. Liao, Y. Zhou, X. Ma, Y. Hao, “Ferroelectric Gate AlGaN/GaN E-Mode HEMTs With High Transport and Sub-Threshold Performance.” IEEE Electron Device Letters, 2018, 39(1):79-82. (8) Q. Zhu,L. Chen, B. Hou, M. Wu, X. Ma, and Y. Hao. “Threshold Voltage Instability (PBTI) of GaN-Based Recessed MOS-HEMTs with Fast-IV-Sweep Method.” The 15th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS) 2018. (9) J. Zhu, Q. Zhu,L. Chen, M. Wu, B. Hou, L. Yang, Y. Hao, and X. Ma, “Exponential dependence of capture cross section on activation energy for interface traps in Al2O3/AlN/AlGaN/GaN metal-insulator-semiconductor heterostructures.” Applied Physics Letters, 2017, 111(16): 163502. (10) J. Zhu, Q. Zhu,L. Chen, B. Hou, L. Yang, and Y. Hao, “Impact of Recess Etching on the Temperature-Dependent Characteristics of GaN-Based MIS-HEMTs With Al2O3/AlN Gate-Stack.” IEEE Transactions on Electron Devices, 2017, 64(3):840-847. 专利: (1)马晓华,陈丽香等.含有铁电栅介质的叠层栅增强型GaN高电子迁移率晶体管及制备方法: 201710558126.4[P]. 2017.10. (2)郝跃,祝杰杰,陈丽香等.基于掺杂HfO2铁电栅介质的AlGaN/GaN增强型HEMT器件及制作方法: 201710557658.6[P]. 2017.10. (3)马晓华,郝跃,陈丽香等. HEMT器件及其制备方法: 201810461440.5[P]. 2018.10. |